2.5D and 3D ASIC design technologies-2.5D SoC SiP-HBM 3D-stacked-DRAM technology
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HBM3/2E/2 IP Subsystem The HBM3/2E/2 IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower latency and more density.https://openfive.com/hbm3-2e-2-ip-subsystem/
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